Original
http://www.etn.se/index.php?option=com_ ... e&id=46776
E aqui uma tradução "meia boca" (para o inglês ficou mais "inteligível" do que direto para português).
The world's best vias minimize embedded systems
By Anna Wennberg (
anna@etn.se)
FROM THE ARCHIVE: 2008-05-06
Uppsala company Ångström Aerospace has developed a construction method technology that few others in the world can match. The base is robust via holes that are easy to process. US Freescale is one of several semiconductor companies that courting the Swedish newcomer.
When Ångström Aerospace is mentioned, many people spontaneously think space technology specialist. And it is right, but also only part of the truth.
- We are a construction method specialists and with our building technology can make almost any embedded system at any time. You just have to be creative, says Fredrik Bruhn, CEO and co-founder of Angstrom Aerospace (AAC).
The company's strength is really very, very small. The key is a proprietary microvia, therefore a hole that is made by a silicon wafer, or disc in any other material, for example gallium arsenide, for passing a signal through. The holes required for it to be possible to build electronic systems directly on the substrate, so-called wafer-level packaging.
Today, many large semiconductor companies such as Intel, ST Microelectronics, IBM, AMD and Fujitsu, various types of mikovior in its production. But they are all specially developed for the application.
- What is special for our highways is that they are incredibly robust. We have one hundred percent yield in a university lab - it is "unheard-of". Our highways are also easy to process and work with most of today's semiconductor processes, says Fredrik Bruhn.
Another significant difference with second vias is Angstroms can be made before as well as after the actual CMOS process no. The latter option means that you do not need to be so careful in the process, no one and that it is therefore possible to achieve economy of it all. Several companies have tried to make holes for CMOS processing, but it does not work well when the holes are created at high temperatures and it destroys the chips.
- Our vias also have the advantage of being able to combine high frequencies and high currents. It allows you to build powerful motordrivare micro scale if, for example, has a built-in systems operated by relays or motors, says Fredrik Bruhn.
Currently collaborating ÅAC with several major semiconductor manufacturers around the vias can be used in different contexts. Together with Freescale and spinntronikforskaren Johan Akerman at KTH, the company has, among other things sought money from the Foundation for Strategic Research (SSF) to conduct research on how to make the most advanced packing of magnetic RAM (MRAM).
The reason that Ångströms vias are so attractive to use for 3D stacking is precisely the CMOS process, no one can be made in advance. It all works so that the semiconductor manufacturer processes their records as normal, then run to the discs in a MEMS foundry that create holes and then add a thin fi lmslager directly on the wafer that connects all the silicon wafers.
It thus creates the address bus and data bus directly on the wafer factory.
Only then cut the disc into desired parts. In Freescale's case it's about memories. If you want to have great memories can saw discs in various formats, say that matrices with 16:05 16 or 8 5 8 silicon wafers. The application usually determines the format.
- Because we put our vias between different memory areas, we can connect everything together in a simple way. More frequent than this, you can not pack the electronics, says Fredrik Bruhn.
He states that the standard measurement of their via holes 200 5 200 microns, as it usual dimension between die on a silicon wafer is 400 microns. But it is possible to make vias with openings from 80 microns to 350 microns. They are metallized, giving them very low resistance, in the MW range. And as already mentioned, fits into both the higher power as high frequency applications.
- Say that you are going to build a radar on a circuit board, and you need 10 kW. Then you must also be able to cool 10 kW, ie ten ring hob home on full power. This requires some special tricks when to stack multiple chips on each other and we solve with our technology. We are the only ones to cope says Fredrik Bruhn.
He also mentions that ÅAC together with Saab Microwave has commissioned from FMV to look at how to make a miniaturization of future Gripen radar.
- This has not been possible to do.
The frequency range I can not reveal, but the defense are working man with radar applications from 8 GHz to 45 GHz.
![8-]](./images/smilies/icon_cool.gif "Cool"){kind=icon}
... ora 2.6 toneladas de armas é pouco ??? ... como poderia ser pouco se o Rafale faz o EQUIVALENTE e chama isso de "pesadamente ARMADA" ? ... DOIS PESOS DUAS MEDIDAS ?